Senior Package Layout Engineer - Hardware

Job Description

NVIDIA is seeking a Senior Package Layout Engineer to work on the design and development of IC substrates for NVIDIA products.

Requirements

• B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
• Experience with HDI designs is a plus
• Significant background with Cadence APD or SiP and/or PCB layout tools
• Solid understanding of high-speed design signal integrity practices
• Experience with Virtuoso and Calibre is a plus
• Experience using Valor is helpful

Responsibilities

• Collaborate with Technical Package Lead and different design teams in the design and development of IC substrates for NVIDIA products
• Plan schedules, resolve costs, manufacturing, and electrical design issues with design teams
• Implement high speed/density ASIC packages
• Perform substrate breakout patterns for ASIC packages
• Optimize package pinout incorporating system level trade-offs of pins assignment
• Help perform package routing, placement, stack-up, reference plane, and power distribution using Cadence APD or SiP tool suite
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

Benefits

• Multiple relocation packages
• Two weeklong shutdowns (mid-summer and year-end) in the US (in addition to PTO)
• 8-week parental leave
• 9 Employee Resource Groups
• Annual bonus offering
• Flexible work arrangements
• Up to 6% 401K matching