Senior Packaging Technical Engineer - Hardware

Job Description

NVIDIA is looking for a Senior Packaging Technical Engineer to define chip pad ring, substrate interconnect scheme, and lead package layout design process.

Requirements

• BSEE or equivalent experience
• Minimum of 8+ years in board/system design
• Experience with package design is preferred
• Good understanding of transmission line theory, power delivery, and signal integrity is desired
• Strong programming and scripting skills in Perl, Python, Tcl desired
• Cadence Skill and EXCEL familiarity are helpful

Responsibilities

• Define chip pad ring, substrate interconnect scheme, and lead the package layout design process
• Collaborate with large teams of Engineers and Managers
• Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust electrical package
• Communicate effectively with various teams throughout the company

Benefits

• Multiple relocation packages
• Two weeklong shutdowns (mid-summer and year-end) in the US (in addition to PTO)
• 8-week parental leave
• 9 Employee Resource Groups
• Annual bonus offering
• Flexible work arrangements
• Up to 6% 401K matching