HPC Hardware / Firmware Engineer - Linux

Job Description

KLA is seeking a Hardware Integration Engineer to define server architectures, design high-performance networks, build and manage BOMs, lead hardware integration, drive functional testing, develop self-test protocols, own the release process, and ensure compliance for HPC server solutions.

Requirements

• Educational background in computer engineering, Electrical Engineering, Computer Science, or related field
• Proven experience in HPC hardware integration, assembly, and testing
• Strong knowledge of networking components and system-level architecture
• Proficiency in Python and Bash scripting
• Familiarity with procurement workflows and part tracking systems
• Excellent documentation, troubleshooting, and project management skills

Responsibilities

• Collaborate with engineering and product teams to specify server contents and technical requirements for HPC systems
• Identify and specify networking components to support real-time, high-bandwidth performance
• Create and maintain accurate Bills of Materials (BOMs) and ensure timely procurement of all components
• Oversee the physical assembly, cabling, and configuration of HPC racks to meet system specs and quality standards
• Partner with the HPC team to conduct rigorous testing and validation of system performance
• Create automated self-tests and diagnostic procedures to ensure reliability and consistency
• Manage the release of HPC server solutions into the broader product ecosystem
• Work with regulatory teams to ensure all hardware meets industry standards and compliance requirements

Benefits

• Performance incentive programs
• Medical, dental, vision, and life insurance (plus other voluntary benefits)
• 401(k) with company matching
• Employee Stock Purchase Program (ESPP)
• Student debt assistance
• Tuition reimbursement program
• Development and career growth opportunities
• Financial planning benefits
• Wellness benefits (including EAP)
• Paid time off and paid company holidays
• Family care and bonding leave