Job Description

Apple is seeking a versatile and passionate IC Packaging Engineer to work on groundbreaking technologies. The role involves IC packaging development, collaboration with cross-functional teams, and driving advanced package solutions to meet various requirements.

Requirements

MS/PhD and 6+ years of experience in relevant industry
Experience in semiconductor packaging and/or system integration
Good understanding of multi-functional packaging areas
Specialist in advanced packaging technologies (FOWLP/2.5D/3D)
Excellent problem solving with strong physics and fundamentals
Excellent communication skills
Basic knowledge of signal integrity/power integrity
Ability to review schematics, package/PCB layout and designs in Allegro

Responsibilities

Responsible for IC packaging development
Work with cross-functional teams and lead SoC Package integration and architecture efforts
Drive the industry with advanced package solutions and new material developments
Deliver optimized solutions to meet electrical, mechanical, thermal requirements
Define and execute test vehicles alongside foundries and OSATs
Lead package failure analysis and root cause investigations
Apply advanced AI/ML and data analytics techniques for process optimization

Benefits

Employees at Apple are often offered comprehensive benefits that support physical and mental well-being—flexible medical plans, confidential counseling, onsite wellness centers at major campuses, and resources for fitness and daily life. Families typically receive fertility support, paid parental leave with gradual return, caregiving leave, and dependent-care guidance, while financial perks commonly include stock grants (with purchase discounts), 401(k) matching, and income-protection coverage. Employees also see robust time off, Apple University learning and tuition reimbursement, donation matching and paid volunteer hours, and deep product and partner discounts.