The role is for a senior level IC packaging engineer focused on developing innovative packaging solutions for consumer markets. The engineer will work in a fast-paced environment, interfacing with internal teams and external suppliers to advance packaging technologies. A strong background in IC packaging and hands-on experience with various manufacturing processes is essential. The position requires excellent communication skills and the ability to conduct independent research.

• Bachelor's degree in a relevant field and 10+ years of industry experience.
• M.S. or Ph.D. degree in mechanical engineering, physics, materials science, or similar disciplines.
• In-depth knowledge of Wafer Level Chip Scale Packaging and BEOL assembly processes.
• Expert level knowledge of common reliability failure modes and device physics.
• Proven track record of bringing products/packages from conceptual stage to high volume manufacturing.

• Develop custom silicon packaging solutions for various consumer markets.
• Interface between product/device design, quality, supply chain, and external suppliers.
• Construct Designs of Experiments and down-select materials and processes.
• Perform independent research and development work with minimal supervision.
• Present ideas, design concepts, data, and plans confidently at team and executive meetings.

• Employees at Apple are often offered comprehensive benefits that support physical and mental well-being—flexible medical plans, confidential counseling, onsite wellness centers at major campuses, and resources for fitness and daily life. Families typically receive fertility support, paid parental leave with gradual return, caregiving leave, and dependent-care guidance, while financial perks commonly include stock grants (with purchase discounts), 401(k) matching, and income-protection coverage. Employees also see robust time off, Apple University learning and tuition reimbursement, donation matching and paid volunteer hours, and deep product and partner discounts.