The Package Design Engineer will be part of Apple's Packaging team, focusing on advanced electronic packaging solutions for various products. This role involves driving the design and integration of semiconductor packages across multiple technologies. The engineer will collaborate with cross-functional teams to enhance design methodologies through automation and AI. The position requires a strong understanding of package architecture and optimization for next-generation products.

• Bachelor's degree in a relevant field is required.
• Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms.
• Strong understanding of high-speed interface layout constraints and Signal/Power Integrity analysis.
• Solid grasp of substrate manufacturing processes and design for manufacturability.
• Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL.

• Lead advanced package architecture and drive next-generation package structure optimization.
• Own Package/SiP/module physical design from concept through tape-out.
• Collaborate closely with cross-functional teams to deliver optimized SI/PI performance.
• Leverage AI tools to enhance design efficiency, quality, and performance.

• Employees at Apple are often offered comprehensive benefits that support physical and mental well-being—flexible medical plans, confidential counseling, onsite wellness centers at major campuses, and resources for fitness and daily life. Families typically receive fertility support, paid parental leave with gradual return, caregiving leave, and dependent-care guidance, while financial perks commonly include stock grants (with purchase discounts), 401(k) matching, and income-protection coverage. Employees also see robust time off, Apple University learning and tuition reimbursement, donation matching and paid volunteer hours, and deep product and partner discounts.