Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer, where you will develop innovative module packaging solutions for new consumer products. This role involves collaborating with internal teams and external suppliers to address complex integration challenges and ensure successful high-volume manufacturing. You will leverage your deep technical expertise in assembly processes and leadership skills to drive the New Product Introduction process. The ideal candidate will have a proven track record of shipping products and experience in a high-volume manufacturing environment.

• BS degree and 10+ years of relevant industry experience.
• Proven track record of successfully shipped products with 3rd party manufacturing partners.
• Strong interpersonal and team-building skills.
• In-depth knowledge in semiconductor sensor packaging technologies.
• Expert-level knowledge in assembly steps including wafer thinning, wafer dicing, die attach, and wirebond.

• Drive the development of innovative module packaging solutions for consumer products.
• Own the process development of New Product Introduction.
• Collaborate with internal cross-functional teams and external suppliers.
• Lead cross-functional teams to success in complex multi-disciplinary development programs.
• Stay up-to-date with the industry landscape on relevant technologies.

• Employees at Apple are often offered comprehensive benefits that support physical and mental well-being—flexible medical plans, confidential counseling, onsite wellness centers at major campuses, and resources for fitness and daily life. Families typically receive fertility support, paid parental leave with gradual return, caregiving leave, and dependent-care guidance, while financial perks commonly include stock grants (with purchase discounts), 401(k) matching, and income-protection coverage. Employees also see robust time off, Apple University learning and tuition reimbursement, donation matching and paid volunteer hours, and deep product and partner discounts.