This role involves owning and driving the electrical and physical design of multi-layer boards for prototype systems at Apple. The focus is on developing reference designs that meet strict area, cost, and performance requirements. You will work with a cross-functional team to understand system requirements and ensure design integrity. The position requires a strong understanding of power and signal integrity fundamentals.

• Bachelor's degree in a relevant field.
• 4+ years of experience in physical design of multi-layer boards.
• Experience in circuit design, schematic capture, and system integration.
• Strong physical understanding of power and signal integrity fundamentals.
• Experience in the physical design of Power Delivery Networks and high-speed signals at PCB level.
• Familiarity with Cadence APD/Allegro for physical design.
• Familiarity with High Density Interconnect PCB and Flip-Chip BGA package substrate technologies.

• Develop physical design implementations that meet stringent power and signal integrity requirements.
• Drive co-optimization of physical design on multi-layer boards and packages.
• Provide implementation guidelines and feedback to silicon, package, and system design groups.
• Perform feasibility studies, design verification, and sign-off.

• Employees at Apple are often offered comprehensive benefits that support physical and mental well-being—flexible medical plans, confidential counseling, onsite wellness centers at major campuses, and resources for fitness and daily life. Families typically receive fertility support, paid parental leave with gradual return, caregiving leave, and dependent-care guidance, while financial perks commonly include stock grants (with purchase discounts), 401(k) matching, and income-protection coverage. Employees also see robust time off, Apple University learning and tuition reimbursement, donation matching and paid volunteer hours, and deep product and partner discounts.