Annapurna Labs within AWS is seeking a Package Layout Design Engineer to join their hardware team. This role focuses on the physical design of advanced IC packages for next-generation machine learning and data center ASICs. The engineer will work closely with senior engineers and various teams to deliver production-ready designs that meet performance and reliability targets. The position involves executing package layout tasks from floor planning through tape out and manufacturing release.

• Bachelor's degree in Electrical Engineering or a related field
• 5+ years of experience in IC package layout and physical design
• Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers
• Hands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent
• Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects
• Working knowledge of package design rules, DFM constraints, and physical verification methodologies
• Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design
• Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams

• Execute package layout tasks across the design cycle including die floor planning and tape out release.
• Implement physical designs for advanced packaging architectures including 2.5D interposer and 3D-IC.
• Support package floorplan development considering die placement and power/ground distribution.
• Perform RDL and substrate routing for high-density interconnects across multi-layer organic substrates.
• Support die-level RDL routing and bump planning in coordination with ASIC physical design teams.
• Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels.
• Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
• Run physical verification checks and support design closure.
• Follow and help refine package design rules and guidelines to ensure DFM compliance.
• Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout.

• Employees at Amazon are often offered comprehensive health benefits—including multiple medical plan options (no pre-existing condition exclusions, 100% covered in-network preventive care), dental and vision plans, a 24/7 medical advice line from day one, expert second-opinion services, and broad mental-health support with several free counseling sessions (including pediatric). Financial wellness typically includes a 401(k) with company match (up to 2%), Restricted Stock Units (equity), FSAs, an emergency savings program, product and partner discounts, and even college-savings and home-purchase programs. Overall, the package is designed to support employees and their families’ health, finances, and day-to-day life.