The PCB Manufacturing Engineer role at Google focuses on developing and scaling manufacturing processes for quantum computing devices. This position is part of the Device Packaging Group, which is responsible for custom packaging technologies for quantum processors and related devices. The engineer will work on ensuring efficient production and reliable operation of quantum computing systems. The role involves implementing design practices and continuously improving manufacturing processes to support Google's mission in quantum AI.

• Bachelor’s degree in Mechanical, Electrical, or Manufacturing Engineering or equivalent practical experience.
• 2 years of experience working with electronics packaging, including wire bonding, die preparation, or printed circuit boards (PCBs).
• 2 years of experience designing, manufacturing, or testing PCBs.
• 2 years of experience managing production processes, including vendor management and continuous process improvements.
• Experience using statistical process control (SPC) and design of experiments (DOE) to develop or improve manufacturing processes.

• Develop, characterize, document, and scale manufacturing processes for the packaging of quantum computing devices.
• Operate, maintain, and troubleshoot key manufacturing equipment.
• Lead vendor management to improve yield and throughput and manage custom workflows.
• Implement and improve internal production processes, including wire bonding and technician training.
• Lead root cause analysis investigations for manufacturing failures and implement effective corrective actions.

• Employees at Google are often offered benefits like comprehensive health insurance, 401(k) matching, and flexible work arrangements, among other benefits.