AMD is seeking an MTS Packaging Engineer to evaluate materials, components, and processes for advanced semiconductor products. The role focuses on ensuring that these products meet specialized design and performance specifications in high-volume manufacturing. The engineer will engage with suppliers for continuous improvement and manage new product introduction activities. Collaboration with internal stakeholders and external manufacturers is essential to drive issue resolution and enhance packaging technology.

• Master's degree or foreign equivalent in Mechanical Engineering, Computer Engineering, Electrical Engineering, or a related field.
• Experience in Flip Chip Packaging and operational experience in bumping process, substrate manufacturing, assembly manufacturing, and lid and stiffener manufacturing process.
• Development work leading to volume production in semiconductor manufacturing.
• Familiarity with JMP and Minitab tools.
• Knowledge of failure analysis and package reliability.

• Evaluate materials and components for advanced semiconductor products.
• Drive supplier engagement for continuous improvement and new capabilities.
• Plan and execute New Product Introduction activities and ramp-up readiness.
• Coordinate market intelligence analysis to identify value engineering initiatives.
• Develop packaging technology to support performance in high-speed interfaces.
• Manage product, components, and materials from conceptual phase to high volume manufacturing.
• Enhance package and board level performance with signal integrity simulation tools.
• Define package technology with trade-offs between electrical performance, cost, quality, reliability, and manufacturability.

• AMD provides a competitive 'Total Rewards' package that focuses on financial growth, health, and work-life balance.