The Advanced Packaging Substrate Integration Team is looking for qualified candidates to manage supplier capacity expansion for advanced heterogeneous packaging technology, EMIB-T. The role requires a combination of project management, technical risk assessment, and supplier management skills. Candidates will work closely with suppliers and internal teams to ensure on-time production ramp and qualification of new capacity. This position involves significant interaction with stakeholders and requires a high tolerance for ambiguity.

• PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering or relevant field and 3+ years of relevant experience, or a Masters Degree in the same fields with 5+ years of relevant experience.
• Demonstrated experience achieving integrated process, materials, chemistry, and/or tool hardware development and customer qualification milestones on-time.
• Experience managing cross-functional teams across multiple time zones and cultural contexts.
• Strong understanding of process building blocks and critical process interactions.
• Strong knowledge of DOE, PCS, and SPC.

• Finalize HVM process flow and define process tool requirements with the TD team and supplier.
• Plan tool selection and production line qualification to minimize ramp risk and meet certification requirements.
• Execute management-aligned capacity expansion plans through systematic processes.
• Create and drive yield-enabling and yield-improvement plans.
• Facilitate technical capability transfer from internal pilot manufacturing line to supplier capacity expansion line.
• Provide regular updates to management and stakeholders on progress and risk mitigation activities.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.