This role focuses on developing media and collaterals for assembly processes and equipment at Intel, requiring regular onsite presence. The position involves optimizing manufacturing efficiency and ensuring quality and reliability in assembly packaging technologies. The team is dedicated to advancing semiconductor manufacturing processes while addressing customer needs and improving product milestones. Candidates will engage in innovative solutions and collaborate with various engineering groups to enhance packaging technology.

• Possess a BS/MS/PhD degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or a Physics related field.
• Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions.
• Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

• Develop media and collaterals for assembly processes and equipment.
• Optimize and improve the efficiency of manufacturing media and collaterals.
• Develop and maintain equipment to evaluate media and collateral solutions under simulated field use conditions.
• Perform media and collateral design, material selection, and prototype development.
• Provide consultation concerning design problems and improvements in the assembly packaging process.
• Deliver standardization in media and collateral qualification and manufacturing prototypes.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.