The Thermal Engineer will focus on thermal design and analysis for GPU, AI accelerators, and data center products. This role involves both simulation and hands-on experimental work to support high-performance computing while meeting thermal requirements. The engineer will collaborate with cross-functional teams to ensure thermal compliance and performance. Additionally, they will develop innovative thermal characterization methods and optimize thermal performance across various levels.

• PhD in Mechanical Engineering, Thermal Sciences, or related field, or MS degree in the same fields with 2+ years of working experience in thermal sciences.
• Minimum 2+ years of experience with thermal simulation tools such as CFD or FEA.
• Minimum 2+ years of knowledge in heat transfer fundamentals and thermal management principles.

• Support the development of packaging thermal solutions for GPU and AI products.
• Assist in thermal design strategies for advanced packaging technologies, including chiplets and multi-chip modules.
• Perform thermal, electrical, and mechanical co-design optimization.
• Design and execute experiments to characterize thermal performance of advanced package to system-level cooling technologies.
• Develop innovative thermal metrology techniques for next-generation thermal management solutions.
• Correlate experimental data with simulation results to improve predictive models.
• Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
• Engage with external customers and ecosystem partners to align thermal solutions with product requirements.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.