This role involves driving the end-to-end development of silicon packaging substrate design, focusing on optimizing performance and cost. The position requires collaboration with silicon and hardware teams to enhance package board performance. The candidate will define design rules, conduct reviews, and resolve violations to ensure high-quality package designs. This role is part of Intel Foundry, which emphasizes cutting-edge semiconductor manufacturing and customer satisfaction.

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 4+ years of experience, or a Master's degree with 3+ years of experience, or a PhD in a related field.
• Experience with package or board design and review tools such as Siemens Xpedition, Cadence Allegro Package Design, Valor NPI, AutoCAD, or SolidWorks.
• Expertise in package design and development, interconnect methodologies, and manufacturability principles.

• Perform substrate fit and routing studies to assess design, performance, and cost tradeoffs.
• Implement physical layout and routing of package designs, ensuring adherence to design rules.
• Optimize silicon-package-board performance and pinout by working closely with silicon and hardware teams.
• Define substrate design rules and conduct internal and external design reviews.
• Analyze data and resolve design rule checks (DRCs) to refine package designs.
• Drive design-for-manufacturability (DFM) strategies to enhance manufacturability and cost efficiency.
• Develop comprehensive documentation and collateral, storing them in the product lifecycle management system of record.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.