The Packaging Module Development Engineer at Intel's Advanced Packaging Technology Manufacturing division will focus on advancing semiconductor packaging technologies. This role involves collaborating with multifunctional teams to develop and optimize assembly processes for high-volume manufacturing. The engineer will also innovate next-generation equipment and materials while managing projects to meet product development timelines. A strong emphasis is placed on technical leadership and problem-solving in a dynamic environment.

• PhD or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field.
• Minimum 1+ years of experience in mechanical design, equipment development, or manufacturing systems, preferably in semiconductor environments.
• Strong experimental background with hands-on laboratory or prototype development experience.
• At least one first-author publication in a peer-reviewed technical journal for PhD candidates.

• Develop First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions for future packaging platforms.
• Collaborate with cross-organizational teams to develop assembly equipment and optimize assembly processes.
• Innovate next generation equipment, materials, and fabrication processes for semiconductor packaging.
• Manage equipment development including pathfinding, new equipment definition, and technology development.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing.
• Respond promptly to foundry customer requests and events.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.