The Silicon Packaging Architect/Engineer role at Intel's Wireless Communications Solutions team focuses on advancing semiconductor packaging technology for WiFi, Bluetooth, and mmWave products. This position involves strategic leadership in package architecture, ensuring compliance with electrical, mechanical, thermal, and reliability standards. The role emphasizes cross-functional collaboration with design teams and manufacturing partners to optimize product performance. The successful candidate will drive innovation and problem-solving in packaging processes to support next-generation wireless technologies.

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field with 4+ years of industry experience, or a Master's degree with 3+ years of experience, or a PhD with 1+ years of experience.
• 2+ years of package assembly technology development experience.
• 2+ years of packaging FEA simulations experience, both mechanical and thermal.
• 2+ years of experience with package assembly manufacturing processes and high-volume manufacturing ramp.

• Translate product requirements into comprehensive package architecture specifications.
• Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards.
• Oversee end-to-end package development processes, from design through production.
• Troubleshoot complex packaging problems and develop innovative, cost-effective solutions.
• Partner with silicon, hardware, and package design teams to ensure high-quality deliverables.
• Ensure seamless transition from design to high-volume production.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.