The Sr. Principal Engineer, Customer Enabling at Intel will lead innovation in assembly packaging technologies, ensuring high-quality product delivery. This role involves engaging with customers to understand their needs and managing technical collaborations. The engineer will influence technical direction, mentor future leaders, and drive advancements in packaging technologies. This position is crucial for achieving Intel's ambitious roadmap and delivering solutions that power billions of devices worldwide.

• Demonstrated expertise in package design and development.
• Experience in testing, including wafer and package testing.
• Proficiency in statistical methods, experimental design, and reliability modeling.
• Technical knowledge in package architecture and design for manufacturability.
• Proven ability to lead initiatives and deliver results.

• Serve as the main contact for all technical collaboration with customers.
• Collaborate with the Customer Packaging team to translate product requirements.
• Participate in technology tradeoff decisions to ensure compliance with standards.
• Translate requirements to internal execution teams and manage customer dashboards.
• Collaborate with silicon and package execution leads to ensure quality outcomes.
• Identify critical technology solutions for future product needs.
• Partner with design teams to ensure manufacturability of package layouts.
• Create reliability requirements and quality screens to address packaging challenges.
• Solve complex technical problems related to packaging processes and materials.
• Drive standardization of quality systems and product qualification.
• Mentor and develop other technical leaders within the organization.
• Formulate technical strategy and align organizational goals with a vision.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.