The Test Module Development Engineer will be part of Intel's Advanced Packaging Technology Manufacturing group, focusing on innovative semiconductor packaging solutions for high-performance computing. This role involves developing and enabling test technologies for advanced packaging, ensuring efficiency and performance in manufacturing processes. The team is dedicated to pushing the boundaries of semiconductor technology, particularly in areas like AI and edge computing. The position requires a strong blend of technical expertise and collaboration with suppliers to drive industry leadership.

• Bachelor's degree in engineering, physics, chemistry or related STEM field with 6+ years of experience, or a Master's degree with 4+ years of experience, or a Ph.D. degree in a related field.
• Experience in electrical test-related processes.
• Knowledge of statistical controls, FMEA, and/or DOE methodologies.

• Execute test technology development and enablement for high-mix, low-volume testing.
• Implement design and development of sophisticated test processes and repair reverse engineering.
• Execute pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap.
• Partner with key equipment and materials suppliers to develop enabling elements of the technology.
• Conduct technology feasibility studies through theoretical simulations and practical engineering methods.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.