The Packaging Module Development Engineer role at Intel's Advanced Packaging Technology Manufacturing division focuses on advancing semiconductor packaging technologies. The engineer will work within the Assembly Technology Development team to provide mechanical modeling support for various R&D projects. This position emphasizes collaboration with Equipment and Process Engineers to resolve issues and improve designs. The engineer will also engage with different engineering roles to enhance understanding of semiconductor packaging technologies.

• Ph.D. degree in Applied Mechanics, Mechanical Engineering, Aerospace Engineering, Civil Engineering, or related STEM field.
• 8+ years of experience in computational mechanics, specifically in mechanical modeling and thermo-mechanical modeling.
• 8+ years of experience with commercial FEA software such as Ansys or Abaqus.

• Provide mechanical modeling support for R&D projects related to Pathfinding, Technology Development, and High-Volume Manufacturing issue resolution.
• Collaborate with Equipment and Process Engineers to define problem statements and boundary conditions.
• Conduct theoretical analysis and numerical modeling to identify solution paths.
• Seek opportunities to improve equipment design and process definition.
• Stay updated with the latest developments in the computational mechanics field.
• Engage with engineers of different job roles to gain a broader understanding of semiconductor packaging technologies.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.