Join Intel's Advanced Packaging Team as a Yield Engineer On Shift (YEOS) within the Substrate Packaging Technology Development organization. This role focuses on providing critical factory support to ensure uninterrupted lot movement through the manufacturing line. The ideal candidate will address equipment, process, and product issues in real-time while contributing to a collaborative workplace culture. You will engage in troubleshooting, recipe modifications, and documentation to enhance operational efficiency.

• Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1+ years of relevant experience, or a Master's degree in a related field.
• Experience with defect metrology or yield tool sustenance, RFC setup, and SPC.
• 1+ years of experience in semiconductor packaging or substrate manufacturing is preferred.
• Flexibility to support night and weekend shifts over extended periods.

• Receive written and verbal passdown from tool owners and previous shift peers.
• Execute tasks based on shift priorities and escalate issues when roadblocks arise.
• Perform key shift activities such as tool troubleshooting, recipe modifications, and executing non-standard procedures.
• Write and update specifications and RFCs after reviews with tool owners and internal stakeholders.
• Provide thorough written and verbal passdown to the incoming shift, ensuring clear communication of activities and issues.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.