The Module Development Engineer, Defect Inspection role is part of the Advanced Packaging Technology and Manufacturing team at Intel. This position focuses on developing, optimizing, and scaling defect inspection solutions for semiconductor manufacturing. The engineer will collaborate with various teams to enhance inspection capabilities and drive yield improvements. This role offers the opportunity to work on cutting-edge semiconductor technologies and influence future manufacturing processes.

• Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field with 4 years of experience, or a Master's degree with 3+ years of experience, or a PhD with 2+ years of experience.
• Experience in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

• Develop and implement defect inspection and metrology technologies for semiconductor manufacturing.
• Design and optimize processes, inspection methods, and equipment performance.
• Conduct process experimentation and feasibility studies using statistical and engineering methods.
• Collaborate with equipment and materials suppliers to introduce new technologies.
• Analyze defect data to identify root causes and improve yield and quality.
• Drive continuous improvement of inspection systems through automation, software, and hardware enhancements.
• Support technology pathfinding and roadmap development for next-generation products.
• Stay current with industry trends, emerging tools, and inspection methodologies.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.