This role focuses on developing and optimizing assembly processes and equipment for Intel's future packaging technologies. The position requires regular onsite presence and involves collaboration with cross-functional teams to ensure quality and reliability in manufacturing. The engineer will utilize innovative engineering concepts and statistical methods to drive continuous improvement initiatives. The role also includes leading problem-solving activities and providing technical consultation related to packaging and manufacturing processes.

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, or a related engineering or science discipline with 5+ years of engineering industry experience.
• Master’s degree in a related engineering field with 3+ years of engineering industry experience.
• PhD in a related engineering field with 6+ months of engineering industry experience.
• Experience in semiconductor manufacturing and/or advanced packaging technologies is preferred.
• Strong collaboration and communication skills with cross-functional teams and external suppliers.

• Develop assembly processes and equipment to enable Intel’s future packaging technologies.
• Optimize and improve manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
• Document technical findings, improvements, and best practices through technical reports and white papers.
• Collaborate with engineering, manufacturing, supplier quality, and procurement teams to establish material specifications.
• Lead problem-solving and process improvement activities using experimental design methodologies and engineering analysis techniques.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.