As a Principal Engineer for Die-to-Wafer Hybrid Bonding at Intel, you will lead the development and scaling of advanced packaging technologies critical for high-performance computing and AI. This role involves driving hybrid bonding capabilities from initial development through to high-volume manufacturing. You will leverage your expertise in hybrid bonding equipment and process development to enhance yield and reliability. Your contributions will directly influence Intel's advanced packaging roadmaps and the overall ecosystem.

• Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
• Proven industry experience in hybrid bonding equipment development and process development.
• Experience in process optimization, yield improvement, and reliability enhancement.
• Ability to translate technology roadmaps into executable module strategies.
• Experience mentoring and developing senior technical talent.

• Define and drive the hybrid bonding technology roadmap.
• Lead module-level process development for die-to-wafer hybrid bonding.
• Drive first-of-a-kind equipment and platform development.
• Develop strategies to address critical hybrid bonding challenges.
• Collaborate across technology development, process integration, and manufacturing teams.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.