JobsPackaging Module Development Engineer
Intel logo

Packaging Module Development Engineer

Intel

Location

Phoenix, AZ

Type

Full-time

Posted

6/3/2026

Compensation

$115,110 - $162,500 per year

Undergraduate with 2+ Years of Experience
Master's with 2+ Years of Experience
Approval 96.6%·Filings 2,117·New hires 632·
💎 Strong Sponsor
·FY 2025

Job description

Join Intel's Advanced Packaging Technology and Manufacturing team to develop and optimize innovative semiconductor packaging solutions. This role focuses on enhancing product performance, manufacturability, and reliability at scale. You will work collaboratively with various teams to ensure scalable solutions while applying statistical methods for continuous improvement. Your contributions will directly impact the future of computing advancements globally.

Requirements

  • Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience, or a Master's degree with 2 years of experience, or a PhD in the same field.
  • Experience with Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Proficiency in mechanical design software such as SolidWorks or AutoCAD.
  • Knowledge of mechanical drawings and Geometric Dimensioning and Tolerancing.

Responsibilities

  • Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets.
  • Apply statistical methods to analyze process performance and drive continuous improvement.
  • Design and execute experiments to validate packaging technologies under environmental stress conditions.
  • Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions.
  • Define equipment specifications and partner with vendors to meet technical and performance requirements.
  • Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques.
  • Lead technical problem-solving efforts and contribute to process innovation initiatives.
  • Document findings and best practices through technical reports and knowledge-sharing forums.
  • Support standardization of qualification processes, quality systems, and engineering methodologies.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

Is this posting expired or inaccurate?