The Integrated Circuit Package Design Engineer at Google will be part of a team focused on developing custom silicon solutions for Google's direct-to-consumer products. This role involves collaborating with various engineering teams to create high-performance package substrate designs for Machine Learning chips. The engineer will manage the entire design process, ensuring optimal performance and manufacturability. This position plays a crucial role in shaping the future of hardware experiences and enhancing system performance.

• Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, or a related field, or equivalent practical experience.
• 4 years of experience in chip package design/layout using Cadence Allegro Package Designer or Mentor Expedition.
• Experience in chip package substrate layout, optimization, design verification, and design for manufacturability.
• Experience in design automation and scripting.

• Develop physical package substrate designs for high-performance computers.
• Implement methodology and CAD flow for efficient substrate design.
• Manage co-design initiatives across chip, package, and system levels.
• Collaborate with signal integrity, power integrity, thermal, and mechanical engineering teams.
• Define and document requirements for package substrate design and bill of materials.

• Employees at Google are often offered benefits like comprehensive health insurance, 401(k) matching, and flexible work arrangements, among other benefits.