The Yield Development Engineer will be integral to Intel's process development lifecycle, focusing on enhancing product quality and driving innovation in semiconductor technologies. This entry-level position involves collaboration across various teams to identify yield limiters and improve manufacturability. The role requires strong analytical skills and the ability to work independently while interfacing with peers and engineers. The engineer will contribute to advanced electronic assembly manufacturing processes and support customer needs.

• Must possess a PhD degree in Materials Science, Chemistry, Chemical Engineering, Applied Physics, or a STEM-related field with 1+ years of experience or a Master's degree with 4+ years of working experience.
• Experience operating UHV-based analytical equipment including ToF-SIMS, Auger/XPS, dynamic SIMS, mIRage, FTIR, Nano-IR, Raman, AFM, SEM/EDS is required.
• Must have the required PhD degree or expect to obtain it by August 2026.
• Proficiency in statistical data analysis tools such as JMP or Python is preferred.
• Experience in semiconductor processing, packaging, and failure analysis techniques is a plus.

• Perform ToF-SIMS, XPS, mIRage, nano IR, and Raman spectroscopy analysis.
• Provide direct customer support and participate in safety initiatives.
• Assist in routine instrument maintenance and development.
• Analyze complex ToF-SIMS/Auger/XPS/IR data.
• Apply fundamental problem-solving skills to electronic packaging manufacturing issues.
• Work independently and successfully interface with peers and other analytical groups.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.