Qualcomm Technologies, Inc. is seeking a highly motivated Staff Packaging Engineer to lead advanced integrated circuit packaging development. The role focuses on driving innovation in packaging for various markets, ensuring the transfer of technologies into high-volume manufacturing. The ideal candidate will have extensive expertise in assembly processes and strong leadership skills to manage multi-functional teams. This position requires collaboration with internal teams and external suppliers to develop manufacturable and reliable products.

• At least 8+ years of experience in the development and high-volume manufacturing of advanced IC packages.
• Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials and processes.
• Strong understanding of Laser Groove technology and Wire Bond process optimization.
• Excellent verbal and written communication skills.
• Bachelor's degree in electrical engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.

• Explore, develop, and deploy FCCSP, FCBGA, and/or SiP/Module packaging technologies for high-volume manufacturing.
• Initiate and define package process flows, material sets, and Best Known Methods.
• Interface with OSATs, substrate and material suppliers, and tool makers to align technology with product requirements.
• Coordinate with internal product teams to establish Design Rules.
• Collaborate with the internal design team to promote Design for Manufacturability methodology.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.