Qualcomm Technologies, Inc. is seeking a highly motivated Staff IC Packaging Engineer to lead the development and commercialization of advanced integrated circuit packaging technologies. This role emphasizes driving innovation and facilitating new product introductions while collaborating with OSAT partners. The ideal candidate will have deep expertise in advanced packaging architectures and assembly processes, along with strong technical leadership skills. The position requires solving complex engineering challenges and managing cross-functional collaboration.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
• Strong expertise in Flip Chip and Wire Bond technologies.
• Experience with high-density interconnect design, substrate technologies, and package architecture.

• Lead development and deployment of advanced packaging technologies including FCCSP, FCBGA, SiP/Modules, RDL-based packages, and 2.5D/3D integration.
• Drive new product introduction from concept to successful transfer into high-volume manufacturing.
• Define and optimize package architectures, including high-density interconnects and performance/reliability trade-offs.
• Develop and establish process flows, material sets, Best Known Methods, and process control plans.
• Collaborate with OSATs, foundries, substrate vendors, and material suppliers to align technology development with product requirements.
• Partner with internal design, modeling, and product teams to implement Design for Manufacturability.
• Lead cross-functional programs, managing timelines, risks, and deliverables across multiple concurrent projects.
• Apply strong knowledge of FMEA, SPC/QC, reliability testing, and failure analysis to ensure robust product development.
• Troubleshoot and resolve complex technical and manufacturing issues across development and production stages.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.