The IC Package Design Engineer at Qualcomm will be part of the Data Center team, focusing on developing high-performance and energy-efficient server solutions. This role requires innovative and teamwork-oriented individuals to drive advanced package selection and optimization. The engineer will work closely with multi-functional teams to ensure optimal mechanical, electrical, and thermal performance of various chips. The position emphasizes the implementation of physical design for packages and modules, along with the exploration of new CAD tools and methodologies.

• Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
• Proficient in Cadence APD & SiP.
• Basic knowledge in high-speed IO interfaces and electromagnetic field.
• Knowledge of IC packaging structures and chip-package interaction.
• Familiarity with various sophisticated package configurations and assembly/substrate technology.

• Own and drive advanced package selection and configuration optimization.
• Responsible for package/SIP physical design and layout, optimization, DV, and tape out.
• Work with multi-functional teams to achieve optimized performance for various types of chips.
• Implement the physical design of packages and modules for SoC.
• Interface and coordinate with multi-functional groups on new product package feasibility analysis and design.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.