Qualcomm Technologies, Inc. is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit packaging technologies. This role focuses on spearheading new product introductions for cutting-edge package technologies, particularly in Data Center AI and Power Management. The engineer will drive innovation from concept to high-volume manufacturing while managing relationships with multiple assembly suppliers. The position requires in-depth expertise in advanced packaging methods and the ability to lead multi-disciplinary teams.

• M.S. or Ph.D. in Mechanical, Electrical, or Materials Engineering, or equivalent experience.
• Seventeen or more years of hands-on experience in packaging technology development.
• Comprehensive understanding of semiconductor industry packaging trends and end-user requirements.
• Familiarity with reliability standards, test methods, and failure analysis techniques.
• Excellent verbal and written communication skills.

• Provide leadership for the development of advanced packaging technologies.
• Oversee new product introductions and ensure smooth transition to high-volume manufacturing.
• Leverage subject matter expertise in package architecture and design constraints.
• Collaborate with and manage multiple foundries and OSATs.
• Resolve complex technical issues encountered throughout the development and manufacturing process.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.