The Principal Chipset Project Engineer – Thermal/Limits at Qualcomm will lead the thermal and limits strategy for the Compute Chipset Project Engineering team. This role focuses on defining thermal budgets, methodologies, and tools to analyze thermal behavior across the compute product portfolio. The engineer will work closely with various engineering leads and engage with OEMs and ODMs to ensure optimal thermal performance. Clear communication of thermal goals and strategies to executives and chipset teams is essential in this highly matrixed environment.

• Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 8+ years of relevant work experience, or a Master's degree with 7+ years, or a PhD with 6+ years.
• 8+ years of experience in semiconductor product development.
• 5+ years in a technical leadership role.
• 8+ years of experience in a thermal systems role, preferably with PC thermal systems experience.

• Leverage expert knowledge to guide design and architectural choices for chipsets and platforms.
• Drive methodology and tool development to analyze and predict thermal behavior.
• Evaluate new thermal solutions and assess the impact of system component selection on thermals.
• Influence system limits management and establish best practices for thermal management.
• Oversee the resolution of all thermal-related issues across chipsets.
• Interact with customers to provide guidance on thermal targets and support on thermal debug and tuning.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.