The Thermal Engineer will be part of Qualcomm's Data Center team, focusing on developing high-performance, energy-efficient server solutions. This role involves hands-on lab work, including thermal testing and validation, while collaborating with cross-functional teams. The engineer will contribute to solving thermal challenges specific to data centers and ensure alignment across various engineering disciplines. The position emphasizes innovation and teamwork in creating next-generation computing platforms.

• Bachelor's or Master's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or related field.
• 5+ years of hands-on experience in thermal engineering within the high-tech industry.
• Strong background in heat transfer fundamentals, including conduction, convection, and radiation.
• Proven hands-on experience with thermal testing equipment and methodologies.
• Familiarity with thermal challenges associated with package design and silicon architecture.

• Lead and execute hands-on thermal testing and characterization of server hardware.
• Validate and improve thermal models and solutions through rigorous lab testing.
• Support thermal simulations at the die/package/system level to analyze and optimize thermals.
• Collaborate with internal teams to provide technical guidance and ensure alignment across requirements.
• Develop and maintain documentation, guidelines, and tools to support design processes.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.