Join Intel's Advanced Packaging Substrate Technology Development team as a Packaging Module Development Engineer, where you will play a crucial role in developing advanced packaging solutions. This position focuses on optimizing manufacturing processes and improving product quality while collaborating with cross-functional teams. You will be involved in hands-on engineering work, contributing to innovative assembly processes and equipment. Ideal candidates will have a passion for manufacturing and a desire to grow within Intel's advanced manufacturing environment.

• Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering discipline with 1+ year of relevant experience.
• Master's degree in one of the above disciplines with no prior experience required.
• PhD in one of the above disciplines with no prior experience required.
• Knowledge of manufacturing process control and equipment adjustment.

• Develop and support advanced assembly processes and equipment for next-generation substrate packaging technologies.
• Plan and execute Design of Experiments (DOEs) to support process optimization and evaluate process, material, and equipment interactions.
• Apply statistical analysis and data-driven methodologies to improve quality, reliability, process capability, manufacturing efficiency, and cost.
• Partner with Procurement and Supplier Quality teams to establish material specifications and support supplier performance and material quality.
• Contribute to process improvements through continuous improvement methodologies and engineering best practices.
• Troubleshoot packaging and manufacturing issues using engineering principles and analytical problem-solving techniques.
• Collaborate with cross-functional teams to resolve process and technology challenges supporting substrate technology development.
• Support process documentation, standardization activities, and preventive and corrective maintenance procedures.
• Work with equipment and material suppliers to support the development and qualification of new tools and materials.
• Contribute to the design, development, and qualification of advanced substrate packaging technologies, including EMIB and Co-EMIB.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.