The New Mexico Silicon Manufacturing Integration team is looking for a motivated engineering professional to take on the role of Process Integration, Yield, and Defect Reduction Engineering Manager. This position involves collaborating with various technical and factory operations teams to support advanced packaging solutions. The main focus is on driving process integration, yield improvement, and defect reduction initiatives to enhance manufacturing quality and efficiency. The role requires regular onsite presence to fulfill essential job responsibilities.

• Master's or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical discipline.
• 5+ years of relevant semiconductor manufacturing or advanced packaging experience.
• Demonstrated track record of technology development and technology transfer.
• Experience solving complex technical problems through innovative engineering approaches.

• Develop and execute a comprehensive defect reduction roadmap to improve yield and product quality.
• Design and implement defect scan strategies, quick-turn analyses, and parametric monitoring systems.
• Leverage Win It Inline methodologies to drive continuous process improvement while meeting quality and reliability objectives.
• Lead a team of process integration, yield, and defect reduction engineers in solving complex manufacturing challenges.
• Collaborate with design, materials, product engineering, characterization, process development, and High Volume Manufacturing (HVM) teams to optimize manufacturing performance.
• Develop scalable and cost-effective manufacturing solutions for advanced packaging technologies.
• Build and maintain inline metrics dashboards for critical process modules and manufacturing parameters.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.