The Chemical Mechanical Planarization (CMP) Process Development Engineer at Intel will focus on developing and sustaining planarization techniques for various materials and architectures in the semiconductor industry. This role is part of the Logic Technology Development (LTD) organization, which is dedicated to overcoming challenges related to Moore's Law. The team emphasizes collaboration and shared learning, drawing from diverse scientific backgrounds to innovate in fabrication processes. Engineers will engage in both high volume manufacturing and future technology development to enable rapid miniaturization of integrated circuits.

• PhD degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Material Science, Physics, Chemistry, Computer Science, or a Semiconductor-related STEM field with a focus on hands-on experimental research.
• Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles, and engineering analysis tools.
• Experimental lab work experience.
• Knowledge of semiconductor and transistor device physics.
• Familiarity with advanced transistor device structures and architectures including fabrication techniques.

• Drive technology development and enablement for high volume manufacturing and future technology.
• Lead design and development of sophisticated manufacturing processes and repair reverse engineering.
• Perform pathfinding activities in support of process and hardware development.
• Recommend and implement modifications for operating equipment to improve production efficiency.
• Partner with key equipment and materials suppliers to develop and implement enabling technology elements.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.