JobsModule Development Engineer (Adv Packaging)
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Module Development Engineer (Adv Packaging)

Intel

Location

Hillsboro, OR

Type

Full-time

Posted

6/23/2026

Compensation

$99,030 - $139,810 per year

Master's Entry-Level
Approval 96.6%·Filings 2,117·New hires 632·
💎 Strong Sponsor
·FY 2025

Job description

This role focuses on driving semiconductor technology development and manufacturing enablement for both high-volume and next-generation technologies. The successful candidate will work closely with internal engineering teams and external suppliers to develop process integration and equipment solutions. This position requires regular onsite presence to support essential business and manufacturing activities. The role emphasizes collaboration, innovation, and the optimization of manufacturing capabilities to meet future product requirements.

Requirements

  • Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline.
  • 1+ years of experience utilizing Statistical Process Control (SPC) and/or Design of Experiments (DOE) methodologies.
  • 1+ years of experience in semiconductor technology development is preferred.
  • 1+ years of experience with semiconductor fabrication processes and manufacturing technologies is preferred.

Responsibilities

  • Drive technology development and manufacturing enablement for current and future semiconductor technologies.
  • Develop process integration and equipment solutions to meet device performance, quality, and manufacturability requirements.
  • Lead the design and development of advanced manufacturing processes, including material selection and parameter optimization.
  • Perform process technology feasibility studies using engineering analysis, simulations, and experimental methods.
  • Conduct pathfinding activities to support hardware and process development for emerging device architectures.
  • Develop technology roadmaps that support future manufacturing and product requirements.
  • Identify and implement process and equipment improvements to increase production efficiency and overall output.
  • Collaborate with equipment and material suppliers to develop and implement enabling technologies.
  • Evaluate manufacturing trends and emerging technologies to identify opportunities for future process innovation.
  • Partner with cross-functional teams to support technology transfer, process qualification, and manufacturing ramp activities.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

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