This role focuses on developing assembly processes and equipment for Intel's future packaging technologies. The team aims to optimize manufacturing efficiency while ensuring quality and reliability. The position requires collaboration with various stakeholders to establish material specifications and improve packaging processes. The ideal candidate will lead innovative efforts and problem-solving initiatives to enhance equipment and processes.

• Bachelor's degree in Engineering, Physics, Chemistry or related STEM field with 6+ years of industry experience, or a Master's degree with 3+ years, or a PhD with 6+ months of industry experience.
• Experience in semiconductor specific processes or research with hands-on equipment support or development is preferred.
• Knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles is advantageous.

• Develop assembly processes and equipment for innovative packaging solutions.
• Optimize manufacturing efficiency to meet quality, reliability, and cost requirements.
• Establish material specifications and ensure adherence to process specifications.
• Lead efforts in innovating and continuously improving equipment and processes.
• Provide consultation on packaging problems and improvements in the packaging process.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.