Intel is seeking a highly motivated mechanical engineer to join the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This role focuses on developing multiphysics thermo-mechanical simulations to support the design and qualification of advanced semiconductor packaging. The position involves collaboration with various engineering and research teams to drive innovation in semiconductor packaging. The ideal candidate will engage in both experimental and numerical methods to solve engineering challenges.

• PhD Degree in Mechanical Engineering, Chemical Engineering, Material Sciences, or a related field with emphasis in solid mechanics.
• 3+ years of thermal-mechanical work/research experience with emphasis on silicon reliability.
• 3+ years of experience with Finite Element Analysis tools.
• 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.

• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
• Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
• Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.