JobsSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging
Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging
AmazonSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging
AmazonLocation
Cupertino, CA
Type
Full-time
Posted
6/27/2026
Compensation
$159,200 - $247,600 per year
Undergraduate with 5+ Years of Experience
Approval 98.6%·Filings 19,451·New hires 10,113·
👑 Elite Sponsor
·FY 2025Job description
Annapurna Labs within AWS is looking for a Sr. Signal & Power Integrity Engineer to join their hardware team. This role focuses on the signal and power integrity analysis and optimization of advanced packaging solutions for next-generation machine learning and data center ASICs. The team values mentorship and knowledge-sharing, fostering an inclusive environment for professional growth. The engineer will be responsible for ensuring advanced packaging technologies meet performance and manufacturing targets.
Requirements
- Bachelor's degree in Electrical Engineering or a related field
- 10+ years of experience in signal integrity, power integrity, and package design
- Deep expertise in package SI/PI analysis including S-parameter extraction and IR drop analysis
- Hands-on experience with EM simulation and SI/PI tools such as HFSS and Cadence Sigrity
- Strong understanding of advanced packaging technologies like 2.5D/3D-IC and silicon interposers
- Experience analyzing and modeling decoupling technologies within the package PDN
- Proficiency in stack-up design and impedance control for multi-layer organic substrates
Responsibilities
- Lead package-level SI/PI analysis for advanced architectures such as 2.5D and 3D-IC.
- Design and optimize package stack-ups for high-speed and power delivery performance.
- Perform high-speed channel simulations for die-to-die and die-to-board interfaces.
- Analyze and optimize the package power delivery network end-to-end.
- Characterize and model on-die capacitance and integrated passive device capacitors.
- Interface with SoC die-level PDN teams to align power grid requirements.
- Perform 3D/2.5D EMIR analysis to validate IR drop and electromigration.
- Model advanced interconnects for both signal and power paths.
- Apply equalization techniques and evaluate package-level channel margins.
- Perform clock distribution and jitter analysis at the package level.
- Collaborate with ASIC design, board design, and packaging teams for co-optimization.
- Identify and mitigate package manufacturing risks related to SI/PI.
- Develop and maintain package SI/PI modeling flows and design guidelines.
Benefits
- Employees at Amazon are often offered comprehensive health benefits—including multiple medical plan options (no pre-existing condition exclusions, 100% covered in-network preventive care), dental and vision plans, a 24/7 medical advice line from day one, expert second-opinion services, and broad mental-health support with several free counseling sessions (including pediatric). Financial wellness typically includes a 401(k) with company match (up to 2%), Restricted Stock Units (equity), FSAs, an emergency savings program, product and partner discounts, and even college-savings and home-purchase programs. Overall, the package is designed to support employees and their families’ health, finances, and day-to-day life.
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