This position focuses on advancing packaging process development at Intel, emphasizing innovative solutions for assembly packaging technologies. The role requires optimizing manufacturing efficiency while ensuring quality and reliability standards are met. The candidate will collaborate with various teams to establish material specifications and improve packaging processes. This role is critical in delivering cutting-edge semiconductor manufacturing solutions.

• Bachelor's degree in engineering, Physics, Chemistry or related field with 6+ years of industry experience, or a master's degree with 4+ years, or a PhD with 2+ years.
• Experience with statistical process controls (SPC).
• Experience with FMEA and/or DOE.
• Semiconductor fabrication related experience.

• Develop assembly processes and apply novel concepts for innovative solutions.
• Optimize and improve the efficiency of manufacturing packages.
• Develop process and equipment specifications and document improvements.
• Ensure manufacturability of physical layout of package design.
• Establish material specifications for contract assemblers and raw material vendors.
• Develop new techniques and acceleration methods for packaging quality.
• Set reliability requirements to meet customer needs.
• Lead efforts towards innovating and continuously improving equipment and processes.
• Provide consultation concerning packaging problems and improvements.
• Deliver standardization in product qualification and manufacturing quality systems.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.