JobsSr Staff or Principal Thermal Engineer, Server Packaging
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Sr Staff or Principal Thermal Engineer, Server Packaging

Qualcomm

Location

San Diego, CA

Type

Full-time

Posted

7/3/2026

Compensation

$180,400 - $270,600 per year

Master's with 5+ Years of Experience
Approval 97.1%·Filings 1,170·New hires 255·
Established Sponsor
·FY 2025

Job description

The Qualcomm Data Center team is focused on developing high-performance, energy-efficient server solutions for data center applications. The role involves creating thermal solutions for server products at both package and system levels, addressing complex thermal management challenges. The qualified individual will collaborate with various stakeholders and utilize advanced simulation tools to drive thermal architecture solutions. This position requires a deep understanding of thermal management design elements and the ability to communicate complex technical content effectively.

Requirements

  • MS in Mechanical Engineering is required, with a PhD preferred.
  • 10+ years of industry experience in electronics cooling related to server products.
  • Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
  • Ability to write scripts in programming languages such as Python, C/C++, and MATLAB for data analysis and tool development.
  • Expertise in conducting CFD simulations and proficiency in software tools such as ANSYS-Icepak and Celsius EC.
  • Capability to design and execute thermal tests within a laboratory environment.
  • Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.
  • Excellent presentation, negotiation, and communication skills.
  • Some experience with AI/ML concepts, algorithms, and methodologies is a plus.

Responsibilities

  • Lead thermal architecture solutions through simulation and testing while collaborating with various stakeholders.
  • Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout the product development phase.
  • Drive direction and strategy discussions and work cross-functionally with technical leads on tradeoffs.
  • Conduct thermal design reviews and presentations to communicate findings.
  • Develop custom software solutions to automate thermal modeling and testing.
  • Conduct thermal tests to validate and characterize models and present results to stakeholders.
  • Analyze and document simulation and test results.

Benefits

  • Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.

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