The Director of Mechanical Simulation at Qualcomm will lead a team focused on delivering FEA-based mechanical simulation solutions for advanced packaging technologies. This senior leadership role requires strategic alignment across various teams, including IC package design and New Product Introduction. The Director will be responsible for developing talent, managing stakeholder relationships, and advancing simulation methodologies. The position emphasizes innovation in simulation workflows and tooling to enhance team efficiency.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
• 12+ years of combined experience in Finite Element modeling and analysis for IC electronic packaging and interconnects.
• 5+ years of direct people management experience.

• Lead a team of engineers responsible for mechanical simulation solutions.
• Drive strategic alignment across IC package design, NPI, assembly, and CPI teams.
• Oversee the development and validation of mechanical FEA models.
• Establish best-known methods for test correlation and material characterization.
• Guide stress and mechanical analysis for IC package designs.
• Champion innovation in simulation workflows and automation.
• Manage cross-functional stakeholder relationships.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.