Qualcomm Technologies, Inc. is seeking a highly motivated Staff Packaging Engineer to lead advanced integrated circuit packaging development and manage the introduction of new product technologies. The role focuses on driving innovation in packaging for various markets, ensuring the transfer of technologies into high-volume manufacturing. The ideal candidate will possess extensive expertise in assembly processes and demonstrate strong leadership in multi-functional teams. This position requires collaboration with internal teams and external suppliers to develop manufacturable and reliable products.

• At least 8+ years of experience in the development and high-volume manufacturing of advanced IC packages.
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
• Strong understanding of Laser Groove technology and Wire Bond process optimization.
• Excellent verbal and written communication skills.
• Demonstrated ability in organized technical project management.

• Explore, develop, and deploy FCCSP, FCBGA, and/or SiP/Module packaging technologies for high-volume manufacturing.
• Initiate and define package process flows, material sets, and Best Known Methods to ensure successful product development.
• Interface with OSATs, substrate and material suppliers, and tool makers to align technology with product requirements.
• Coordinate with internal product teams on establishing Design Rules.
• Manage technical programs, including planning, execution, and monitoring of complex processes or product developments.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.