Qualcomm Technologies, Inc. is seeking a highly experienced PCB Engineer to lead the development of next-generation Datacenter and High-performance computing platforms. This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both new product introduction and volume production. The engineer will work closely with cross-functional teams to enhance board performance and drive Qualcomm's hardware roadmap. This position requires a strong understanding of PCB design and manufacturing processes.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of relevant work experience, or a Master's degree with 7+ years, or a PhD with 6+ years.
• 15+ years of PCB/substrate engineering experience, preferably in Datacenter or high-speed systems.
• Strong understanding of high-speed design fundamentals and advanced PCB fabrication processes.
• Experience working directly with PCB suppliers for fabrication and assembly.
• Proven track record in new product introduction builds and manufacturing issue resolution.

• Define and drive PCB design guidelines, stack-up, and routing strategy for high-speed, high-layer count datacenter PCB boards.
• Develop and maintain design for manufacturability libraries to ensure compliance with supplier capabilities.
• Engage with PCB manufacturers to understand design rule capabilities and evaluate BOM capabilities.
• Support critical new product introduction builds for datacenter platforms and troubleshoot PCB fabrication and assembly issues.
• Drive PCB technology roadmap development in collaboration with suppliers and monitor industry trends.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.