The Plasma Etch Process Development Engineer will join the advanced packaging team at Intel, focusing on developing and optimizing dry etch processes for next-generation semiconductor packaging technologies. This role involves collaboration with equipment suppliers and cross-functional teams to enhance manufacturing solutions. The engineer will also be responsible for monitoring production efficiency and implementing modifications to improve performance. The position requires a strong background in semiconductor manufacturing and process development.

• Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
• Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
• Experience in process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
• Familiarity with Design of Experiments (DOE), process development methodology, and statistical process control.
• Experience with plasma etch equipment platforms.

• Develop and optimize plasma etch processes for advanced packaging applications.
• Design experiments to characterize process windows and optimize etch performance.
• Develop and execute technology roadmaps to meet future manufacturing needs.
• Partner with equipment suppliers to design, test, and implement innovative process solutions.
• Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
• Identify and implement modifications to improve equipment performance and reduce costs.
• Collaborate cross-functionally to develop scalable, robust manufacturing solutions.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.