The candidate will work in a collaborative engineering environment focused on signal and power integrity tasks. This role involves interfacing with package and IC designers to optimize package design, primarily through electrical model extraction and simulations. The engineer will be responsible for high-speed memory interfaces and must effectively document and present results. Strong communication skills and the ability to work across organizational boundaries are essential.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
• 3+ years of experience in DDR in Package/PCB/System Design related to compute/server standards.

• Perform various IO analyses using established methodologies, from model extraction through simulation and reporting of conclusions.
• Apply established methodologies to analyze IO power distribution in product development and reference systems.
• Perform package extraction for time domain and frequency domain analysis and provide design guidelines for the package design.
• Create clear and complete documentation of results.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.