Join Intel as a Packaging Module Development Engineer in Laser Assembly, where you will play a crucial role in advancing semiconductor packaging technologies. This position offers the opportunity to contribute to innovative processes and equipment that enhance Intel's assembly and packaging solutions. Your work will directly influence the performance and reliability of these technologies, addressing the evolving needs of the semiconductor industry. Collaborating with cross-functional teams, you will help drive Intel's mission of delivering world-class packaging solutions.

• Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 4+ years of industry experience.
• Master's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 3+ years of industry experience.
• PhD in Engineering, Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 6 months+ of industry experience.
• Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
• Demonstrated experience applying engineering principles to develop innovative laser solutions for packaging processes and equipment.
• Strong analytical skills with expertise in data analysis, risk assessment, and problem-solving methodologies.

• Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
• Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
• Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.
• Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
• Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
• Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.
• Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.
• Influence material selection, process design, and equipment development to align with customer needs and product requirements.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.