Join Intel as a Packaging Module Development Engineer in Laser Assembly, where you will play a crucial role in advancing semiconductor packaging technologies. This position offers the opportunity to develop innovative processes and equipment that enhance the performance and reliability of Intel's packaging solutions. You will collaborate with cross-functional teams to drive advancements in technology that meet the evolving needs of the semiconductor industry. Your expertise will directly influence the quality and efficiency of manufacturing processes.

• Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field or a Master's degree in the same fields.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Fundamental understanding of laser and optical systems.

• Design and develop laser assembly packaging processes and equipment for next-generation technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
• Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes.
• Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
• Innovate new techniques and tools for early identification of potential packaging quality and reliability issues.
• Set laser process reliability requirements based on an understanding of failure mechanisms.
• Drive standardization in qualification procedures and manufacturing quality systems.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.