JobsThermal Quality and Reliability Engineer
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Thermal Quality and Reliability Engineer

Intel

Location

Phoenix, AZ

Type

Full-time

Posted

7/9/2026

Compensation

$120,860 - $170,630 per year

PhD Entry-Level
Approval 96.6%·Filings 2,117·New hires 632·
💎 Strong Sponsor
·FY 2025

Job description

As a Packaging Quality and Reliability Engineer at Intel, you will be integral to ensuring the quality and reliability of semiconductor packaging components. This role involves collaborating with cross-functional teams to develop and maintain standards that meet stringent product requirements. You will analyze data to identify risks and improve processes, while also innovating reliability models and testing mechanisms. Your contributions will directly impact Intel's product development and customer satisfaction.

Requirements

  • PhD degree in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or a related field.
  • At least 6 months of experience in semiconductor packaging and assembly processes.
  • Understanding of failure modes and mechanisms.
  • Proficiency in statistical process control and reliability modeling.
  • Knowledge of design of experiments (DOE) principles and data analytics tools.
  • Experience with package technologies such as Ball Grid Array (BGA) or wafer-level manufacturing.
  • Familiarity with advanced analytical lab techniques like acoustic imaging, SEM, EDX, FTIR, or mechanical testing.
  • Programming or scripting experience for data analysis using Python, SQL, or similar tools.
  • Strong problem-solving skills and experience with methodologies like 8D and 5 Whys.

Responsibilities

  • Develop and maintain quality and reliability standards for packaging components.
  • Evaluate materials, processes, and techniques used in production to ensure compliance with requirements.
  • Define metrology strategies to capture quality parameters across modules for packaging.
  • Develop and sustain equipment to evaluate silicon and packaging technologies under simulated field conditions.
  • Analyze quality and wearout reliability data to identify potential risk areas.
  • Develop reliability models by performing statistical analysis to assess risks.
  • Innovate new acceleration techniques and analytical tools for early identification of issues.
  • Drive standardization in product qualification and manufacturing quality systems.
  • Collaborate with internal teams and external partners to ensure packaging process maturity.
  • Respond to quality excursions and provide recommendations to improve product reliability.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

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